​August 2023

• Congratulations！Tzu-Hsuan Chang, Rui-Teng Chang, Wei-Cheng Kang, Chang-Tsun Shih, Han-Lun Chuang, Jhen-Yu Guo, Liang-Chi Huang,Ko-Cheng Lu have been accepted for their patent "Face-to-Face 2-Stack CFET 6T-SRAM Array Stacking with Supervia Achieving Reduction of Delay Time and Access Time". 

• Congratulations to Rui-Teng Chang, Chang-Tsun Shih and Yun-Hong Yang, for their successful graduation.

• Congratulations! Liang-Chi Huang got the 2023 Pilot Program for Doctoral Scholarships.

• Congratulations！Chia-Lien Chao won the 2023 MRS fall session poster.

May 2023

• Jheng-Ying Wu's paper "High-Quality GeSn Thin-Film Resonant Cavities for Short-Wave Infrared Applications" has been selected as Editor's Picks by Journal of Vacuum Science & Technology B.

March 2023

• Rong-Teng Lin's paper "High thermal conductive Graphene-based Composites and its Controllable ESD Application on Device Packaginghas" been accepted by 2023 IEEE EOS/ESD Symposium.

• Teng-Chin Hsu's paper "Electron-Phonon Interaction toward Engineering Carrier Mobility of Periodic Edge Structured Graphene Nanoribbons" has been accepted by Scientific Report.

October 2022

• Congratulations！Teng-Chin Hsu, Bi-Xian Wu, Rong-Teng Lin and Tzu-Hsuan Chang won the Best Paper Award in IEDMS 2022 – "Wafer Scale Graphene Nanoribbons with High Mobility through Periodic Phonon Interaction".

August 2022

• Congratulations to Teng-Chin Hsu, Rong-Teng Lin and Wei-Cheng Kang, for their successful graduation.

March 2022

• Congratulations！Tzu-Hsuan Chang, Chieng-Liang Chen and Rong-Teng Lin have been accepted for their patent "Enhancement of Dielectric and Thermal Properties Through Blending of Pre-Mixed CNF/h-BN Composites."

• Congratulations！Tzu-Hsuan Chang, Rong-Teng-Lin, Bi-Xian-Wu, Teng-Chin Hsu, Chien-Liang Chen and Yun-Hong Yang have been accepted for their patent "Enhancement of Electrostatic Discharge, Electromagnetic Shielding, and Thermal Properties through Packaging with new 2D Composites."

• Congratulations！Tzu-Hsuan Chang, Liao-Yu Rong and Kang-Wei Cheng have been accepted for their patent, "Novel contactapproaches for 3D Electronics."

• Congratulations！Tzu-Hsuan Chang, Kang-Wei Cheng, Weng-Wei Yang, Cheng-Yu Tzu, Hsu-Huang Chun and Liao-Yu Jung have been accepted for their patent "Novel Design Thought Based on New 3D Fabric Techniques."

January 2022

• Congratulations to Jheng-Ying Wu, for his successful graduation.

December 2021

• Congratulations！Shu-Yuan Chang has been accepted for oral presentation in 2022 VLSI-TSA Technical Program Committee.

August 2021

• Congratulations to Yu-Tzu Cheng and Yu-Fu Wang, for their successful graduation.

March 2021

• Congratulations! Yen-Ju Yang and Shu-Yuan Chang got the 2021 1H TSMC scholarships.

August 2020

• Congratulations to Chien-Liang Chen and Chia-Jen Chien, the first master students in this group, for their successful graduation.

July 2020

• Congratulations! Jheng-Ying Wu and Yu-Fu Wang won the third prize in 2020 NTUEE Undergraduate Innovation Award!

• Congratulations! Undervaluation student Jheng-Ying Wu got the 2019 MOST Undergraduate Research Award!

• Congratulations! Pf. Tzu-Hsuan Chang got the 2020 TSMC semiconductor industry-academia cooperation program for Junior Research Investigators.

April 2020

• Congratulations to our team for winning the joint project of NTU, NTNU and NTUST.

June 2019

• Congratulations! Yu-Fu Wang was admitted by the 2019 ISTDM/ISCC conference.